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Transistor Specification Selection Guide
FET Package Options
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- What:
- available field effect transistor packages
- Direction:
- depends on application
- Surface mount (SMT) compatibility is a requirement for most volume assembly applications. Plastic packages limit maximum junction temperatures to 150 C vs 175 C for other packages, so may limit performance of power products. Ceramic or hermetic packages are typically required for hi-rel applications, and typically offer better performance through reduced parasitics. Packages with high parasitic inductance and/or capacitance (typically plastic packages) may severely limit device performance at higher frequencies (above 2 GHz).
- Range:
- SMT (surface mount)
- Surface mount packages have co-planer leads that allow for device mounting without the use of through holes. Surface mount capability is generally considered to be a requirement for automated assembly.
- plastic
| 43 |
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SOT-343: SC-70 4 lead miniature |
| 63 |
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SOT-363: SC-70 6 lead miniature |
| 86 |
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4 formed lead 85 mil low parasitic improved thermals |
- ceramic
| 35 |
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4 lead ceramic "micro-x" |
| 36 |
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4 lead ceramic "micro-x" with lead trim |
| 77 |
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4 lead 70 mil ceramic low cost for high frequency, high performance |
- hermetic
| 70 |
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4 lead 70 mil stripline for high performance |
- non-SMT
- chip
| 00 |
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unpackaged chip - obsolete option |
- plastic
| 84 |
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4 trimmed axial lead 85 mil low parasitic improved thermals |
- power
| 01 |
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100 mil flange |
| 71 |
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70 mil flange - obsolete option |
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