Surface mount (SMT) compatibility is a requirement for most volume assembly applications. Plastic packages limit maximum junction temperatures to 150 C vs 200 C for other packages, so may limit performance of power products. Ceramic or hermetic packages are typically required for hi-rel applications, and typically offer better performance through reduced parasitics. Packages with high parasitic inductance and/or capacitance (typically plastic packages) may severely limit device performance at higher frequencies (above 2 GHz).
Range:
SMT (surface mount)
Surface mount packages have co-planer leads that allow for device mounting without the use of through holes. Surface mount capability is generally considered to be a requirement for automated assembly.
plastic
08
SO-8: 8 lead industry standard (for power)
11
SOT-143: industry standard low parasitic
25
MSOP-3: mini-mold for power applications
32
SOT-323: SC-70 3 lead miniature
33
SOT-23: 3 lead industry standard
43
SOT-343: SC-70 4 lead miniature
63
SOT-363: SC-70 6 lead miniature
86
4 formed lead 85 mil low parasitic improved thermals
ceramic
35
4 lead ceramic "micro-x"
36
4 lead ceramic "micro-x" with lead trim
hermetic
10
4 lead 100 mil stripline for high performance for larger die
70
4 lead 70 mil stripline for high performance
non-SMT
chip
00
unpackaged chip
plastic
85
4 axial lead 85 mil low parasitic improved thermals
