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SPICE Library: MSA Series Package Models

  Models are available for the following MSA series packages:

  • 00 (chip)
  • 04 (145 mil plastic)
  • 05 (145 mil SMT plastic)
  • 10 (100 mil ceramic)
  • 11 (SOT-143)
  • 20 (200 mil BeO disc)
  • 23 (230 mil BeO flange)
  • 35 (micro-x)
  • 36 (trim lead micro-x)
  • 70 (70 mil ceramic)
  • 85 (85 mil plastic)
  • 86 (SMT 85 mil plastic)


MSA Package Style 00 (Chip Form) model

[ top ]
SPICE model for MSA Gain Blocks in style 00 package (chip form)
*replace "MSA**00" in line 1 with product name
*e.g. : .SUBCKT MSA0600 70      20      40
*replace "MSA**" in line 6 with die callout
*e.g. : XDIE    70      35      55      MSA06

.SUBCKT MSA**10 70      20      40
LLB     20      35      .5NH
LLE     40      55      .2NH
* CALL DIE MODEL
XDIE    70      35      55      MSA**
.ENDS

MSA Package Style 04 (145 mil plastic) model

[ top ]
SPICE model for MSA Gain Blocks in style 04 package
*replace "MSA**04" in line 2 with product name
*e.g. : .SUBCKT  MSA1104   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE   DIEOUT   DIEIN   DIEGND   MSA11

* "04" PACKAGE MODEL
.SUBCKT MSA**04   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .189PF
LT1     11      12      1.083NH
C2T1    12      0       .189PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .153PF
LT2     14      15      .190NH
C2T2    15      0       .153PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .140PF
LT3     13      DIEOUT  .824NH
C2T3    DIEOUT  0       .140PF
* Bond wire inductance
LLB     12      DIEIN   .6NH
LLE     15      DIEGND  .2NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .03PF
CCEC    15      DIEOUT  .04PF
CCBC    12      DIEOUT  .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 05 (SMT 145 mil plastic) model

[ top ]
SPICE model for MSA Gain Blocks in style 05 package
*replace "MSA**05" in line 2 with product name
*e.g. : .SUBCKT  MSA1105   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE   DIEOUT   DIEIN   DIEGND   MSA11

* "05" PACKAGE MODEL
.SUBCKT MSA**05   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .189PF
LT1     11      12      1.083NH
C2T1    12      0       .189PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .153PF
LT2     14      15      .190NH
C2T2    15      0       .153PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .140PF
LT3     13      DIEOUT  .824NH
C2T3    DIEOUT  0       .140PF
* Bond wire inductance
LLB     12      DIEIN   .6NH
LLE     15      DIEGND  .2NH
* Contact inductance
LL1     IN      11      .15NH
LL2     GND     14      .06NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .03PF
CCEC    15      DIEOUT  .04PF
CCBC    12      DIEOUT  .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 10 (100 mil ceramic) model

[ top ]
SPICE model for MSA Gain Blocks in style 10 package
*replace "MSA**10" in line 2 with product name
*e.g. : .SUBCKT  MSA1110   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE   DIEOUT   DIEIN   DIEGND   MSA11

* "10" PACKAGE MODEL
.SUBCKT MSA**10   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .100PF
LT1     11      12      .401NH
C2T1    12      0       .100PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .032PF
LT2     14      15      .078NH
C2T2    15      0       .032PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .113PF
LT3     13      DIEOUT  .450NH
C2T3    DIEOUT  0       .113PF
* Bond wire inductance
LLB     12      DIEIN   .65NH
LLE     15      DIEGND  .1NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .03PF
CCEC    15      DIEOUT  .03PF
CCBC    12      DIEOUT  .05PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 11 (SOT-143) model

[ top ]
SPICE model for MSA Gain Blocks in style 11 package
*replace "MSA**11" in line 2 with product name
*e.g. : .SUBCKT  MSA0311   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA03DIE   DIEOUT   DIEIN   DIEGND   MSA03

* "11" PACKAGE MODEL
.SUBCKT MSA**11   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .11PF
LT1     11      12      .40NH
C2T1    12      0       .11PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .06PF
LT2     14      15      .10NH
C2T2    15      0       .06PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .13PF
LT3     13      DIEOUT  .47NH
C2T3    DIEOUT  0       .13PF
* Bond wire inductance
LLB     12      DIEIN   .5NH
LLE     15      DIEGND  .25NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEC    15      DIEOUT  .01PF
CCEB    12      15      .04PF
CCBC    12      DIEOUT  .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS


MSA Package Style 20 (200 mil Beo disc) model

[ top ]
SPICE model for MSA Gain Blocks in style 20 package
*replace "MSA**20 in line 2 with product name
e.g. : .SUBCKT  MSA0520 OUT   IN   GND
replace "A**" in line 27 with die callout
e.g. : XA05   DIEOUT   DIEIN   DIEGND   MSA05

* "20" PACKAGE MODEL
.SUBCKT MSA**20  OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .150PF
LT1     11      12      .730NH
C2T1    12      0       .150PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .098PF
LT2     14      15      .122NH
C2T2    15      0       .098PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .297PF
LT3     13      DIEOUT  1.346NH
C2T3    DIEOUT  0       .297PF
* Bond wire inductance
LLB     12      DIEIN   .55NH
LLE     15      DIEGND  .2NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .04PF
CCEC    15      DIEOUT  .02PF
CCBC    12      DIEOUT  .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 23 (230 mil Beo flange) model

[ top ]
SPICE model for MSA Gain Blocks in style 23 package

The package model for the 23 package in association with the MSA10 die has not been developed. Please refer to the Agilent Technologies Communincations Components catalog AT-64023 model for an approximation. The MSA-10 geometery does not use an external input capacitor (Cin), so omit this element from the model


MSA Package Style 35 (micro-x) model

[ top ]
SPICE model for MSA Gain Blocks in style 35 package
*replace "MSA**35" in line 2 with product name
*e.g. : .SUBCKT  MSA0835   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE   DIEOUT   DIEIN   DIEGND   MSA08

* "35" PACKAGE MODEL
.SUBCKT MSA**35   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .061PF
LT1     11      12      .507NH
C2T1    12      0       .061PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .055PF
LT2     14      15      .098NH
C2T2    15      0       .055PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .087PF
LT3     13      DIEOUT  .721NH
C2T3    DIEOUT  0       .087PF
* Bond wire inductance
LLB     12      DIEIN   .6NH
LLE     15      DIEGND  .3NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .01PF
CCEC    15      DIEOUT  .03PF
CCBC    12      DIEOUT  .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 36 (trim lead micro-x) model

[ top ]
SPICE model for MSA Gain Blocks in style 36 package
*replace "MSA**36" in line 2 with product name
*e.g. : .SUBCKT  MSA0836   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE   DIEOUT   DIEIN   DIEGND   MSA08

* "36" PACKAGE MODEL
.SUBCKT MSA**36   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .061PF
LT1     11      12      .507NH
C2T1    12      0       .061PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .055PF
LT2     14      15      .098NH
C2T2    15      0       .055PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .087PF
LT3     13      DIEOUT  .721NH
C2T3    DIEOUT  0       .087PF
* Bond wire inductance
LLB     12      DIEIN   .6NH
LLE     15      DIEGND  .3NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .01PF
CCEC    15      DIEOUT  .03PF
CCBC    12      DIEOUT  .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 70 (70 mil ceramic) model

[ top ]
SPICE model for MSA Gain Blocks in style 70 package7
*replace "MSA**70 in line 2 with product name
*e.g. : .SUBCKT  MSA0870 OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA08   DIEOUT   DIEIN   DIEGND   MSA08

* "70" PACKAGE MODEL
.SUBCKT MSA**70  OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .070PF
LT1     11      12      .224NH
C2T1    12      0       .070PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .019PF
LT2     14      15      .034NH
C2T2    15      0       .019PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .098PF
LT3     13      DIEOUT  .312NH
C2T3    DIEOUT  0       .098PF
* Bond wire inductance
LLB     12      DIEIN   .5NH
LLE     15      DIEGND  .14NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .02PF
CCEC    15      DIEOUT  .01PF
CCBC    12      DIEOUT  .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 85 (85 mil plastic) model

[ top ]
SPICE model for MSA Gain Blocks in style 85 package
*replace "MSA**85" in line 2 with product name
*e.g. : .SUBCKT  MSA0885   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE   DIEOUT   DIEIN   DIEGND   MSA08

* "85" PACKAGE MODEL
.SUBCKT MSA**85   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .059PF
LT1     11      12      .493NH
C2T1    12      0       .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .042PF
LT2     14      15      .076NH
C2T2    15      0       .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .039PF
LT3     13      DIEOUT  .330NH
C2T3    DIEOUT  0       .039PF
* Bond wire inductance
LLB     12      DIEIN   .55NH
LLE     15      DIEGND  .1NH
* Contact inductance
LL1     IN      11      .05NH
LL2     GND     14      .01NH
LL3     OUT     13      .05NH
*Parasitic capacitances
CCEB    12      15      .02PF
CCEC    15      DIEOUT  .03PF
CCBC    12      DIEOUT  .03PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS

MSA Package Style 86 (SMT 85 mil plastic) model

[ top ]
SPICE model for MSA Gain Blocks in style 86 package
*replace "MSA**86" in line 2 with product name
*e.g. : .SUBCKT  MSA0886   OUT   IN   GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE   DIEOUT   DIEIN   DIEGND   MSA08

* "86" PACKAGE MODEL
.SUBCKT MSA**86   OUT   IN   GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    11      0       .059PF
LT1     11      12      .493NH
C2T1    12      0       .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    14      0       .042PF
LT2     14      15      .076NH
C2T2    15      0       .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    13      0       .039PF
LT3     13      DIEOUT  .330NH
C2T3    DIEOUT  0       .039PF
* Bond wire inductance
LLB     12      DIEIN   .55NH
LLE     15      DIEGND  .1NH
* Contact inductance
LL1     IN      11      .55NH
LL2     GND     14      .06NH
LL3     OUT     13      .25NH
*Parasitic capacitances
CCEB    12      15      .02PF
CCEC    15      DIEOUT  .03PF
CCBC    12      DIEOUT  .03PF
* INSERT DIE MODEL
XA**DIE DIEOUT  DIEIN   DIEGND  MSA**
.ENDS
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this page last updated: 1 October 1999