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SPICE Library: MSA Series Package Models
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Models are available for the following MSA series packages:
- 00 (chip)
- 04 (145 mil plastic)
- 05 (145 mil SMT plastic)
- 10 (100 mil ceramic)
- 11 (SOT-143)
- 20 (200 mil BeO disc)
- 23 (230 mil BeO flange)
- 35 (micro-x)
- 36 (trim lead micro-x)
- 70 (70 mil ceramic)
- 85 (85 mil plastic)
- 86 (SMT 85 mil plastic)
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- SPICE model for MSA Gain Blocks in style 00 package (chip form)
*replace "MSA**00" in line 1 with product name
*e.g. : .SUBCKT MSA0600 70 20 40
*replace "MSA**" in line 6 with die callout
*e.g. : XDIE 70 35 55 MSA06
.SUBCKT MSA**10 70 20 40
LLB 20 35 .5NH
LLE 40 55 .2NH
* CALL DIE MODEL
XDIE 70 35 55 MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 04 package
*replace "MSA**04" in line 2 with product name
*e.g. : .SUBCKT MSA1104 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE DIEOUT DIEIN DIEGND MSA11
* "04" PACKAGE MODEL
.SUBCKT MSA**04 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .189PF
LT1 11 12 1.083NH
C2T1 12 0 .189PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .153PF
LT2 14 15 .190NH
C2T2 15 0 .153PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .140PF
LT3 13 DIEOUT .824NH
C2T3 DIEOUT 0 .140PF
* Bond wire inductance
LLB 12 DIEIN .6NH
LLE 15 DIEGND .2NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .03PF
CCEC 15 DIEOUT .04PF
CCBC 12 DIEOUT .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
-
- SPICE model for MSA Gain Blocks in style 05 package
*replace "MSA**05" in line 2 with product name
*e.g. : .SUBCKT MSA1105 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE DIEOUT DIEIN DIEGND MSA11
* "05" PACKAGE MODEL
.SUBCKT MSA**05 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .189PF
LT1 11 12 1.083NH
C2T1 12 0 .189PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .153PF
LT2 14 15 .190NH
C2T2 15 0 .153PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .140PF
LT3 13 DIEOUT .824NH
C2T3 DIEOUT 0 .140PF
* Bond wire inductance
LLB 12 DIEIN .6NH
LLE 15 DIEGND .2NH
* Contact inductance
LL1 IN 11 .15NH
LL2 GND 14 .06NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .03PF
CCEC 15 DIEOUT .04PF
CCBC 12 DIEOUT .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 10 package
*replace "MSA**10" in line 2 with product name
*e.g. : .SUBCKT MSA1110 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA11DIE DIEOUT DIEIN DIEGND MSA11
* "10" PACKAGE MODEL
.SUBCKT MSA**10 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .100PF
LT1 11 12 .401NH
C2T1 12 0 .100PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .032PF
LT2 14 15 .078NH
C2T2 15 0 .032PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .113PF
LT3 13 DIEOUT .450NH
C2T3 DIEOUT 0 .113PF
* Bond wire inductance
LLB 12 DIEIN .65NH
LLE 15 DIEGND .1NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .03PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .05PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 11 package
*replace "MSA**11" in line 2 with product name
*e.g. : .SUBCKT MSA0311 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA03DIE DIEOUT DIEIN DIEGND MSA03
* "11" PACKAGE MODEL
.SUBCKT MSA**11 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .11PF
LT1 11 12 .40NH
C2T1 12 0 .11PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .06PF
LT2 14 15 .10NH
C2T2 15 0 .06PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .13PF
LT3 13 DIEOUT .47NH
C2T3 DIEOUT 0 .13PF
* Bond wire inductance
LLB 12 DIEIN .5NH
LLE 15 DIEGND .25NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEC 15 DIEOUT .01PF
CCEB 12 15 .04PF
CCBC 12 DIEOUT .04PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 20 package
*replace "MSA**20 in line 2 with product name
e.g. : .SUBCKT MSA0520 OUT IN GND
replace "A**" in line 27 with die callout
e.g. : XA05 DIEOUT DIEIN DIEGND MSA05
* "20" PACKAGE MODEL
.SUBCKT MSA**20 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .150PF
LT1 11 12 .730NH
C2T1 12 0 .150PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .098PF
LT2 14 15 .122NH
C2T2 15 0 .098PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .297PF
LT3 13 DIEOUT 1.346NH
C2T3 DIEOUT 0 .297PF
* Bond wire inductance
LLB 12 DIEIN .55NH
LLE 15 DIEGND .2NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .04PF
CCEC 15 DIEOUT .02PF
CCBC 12 DIEOUT .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 23 package
The package model for the 23 package in association with the MSA10 die has not been developed.
Please refer to the Agilent Technologies Communincations Components catalog AT-64023 model for an approximation.
The MSA-10 geometery does not use an external input capacitor (Cin), so omit this element from the model
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- SPICE model for MSA Gain Blocks in style 35 package
*replace "MSA**35" in line 2 with product name
*e.g. : .SUBCKT MSA0835 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE DIEOUT DIEIN DIEGND MSA08
* "35" PACKAGE MODEL
.SUBCKT MSA**35 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .061PF
LT1 11 12 .507NH
C2T1 12 0 .061PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .055PF
LT2 14 15 .098NH
C2T2 15 0 .055PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .087PF
LT3 13 DIEOUT .721NH
C2T3 DIEOUT 0 .087PF
* Bond wire inductance
LLB 12 DIEIN .6NH
LLE 15 DIEGND .3NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .01PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
-
- SPICE model for MSA Gain Blocks in style 36 package
*replace "MSA**36" in line 2 with product name
*e.g. : .SUBCKT MSA0836 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE DIEOUT DIEIN DIEGND MSA08
* "36" PACKAGE MODEL
.SUBCKT MSA**36 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .061PF
LT1 11 12 .507NH
C2T1 12 0 .061PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .055PF
LT2 14 15 .098NH
C2T2 15 0 .055PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .087PF
LT3 13 DIEOUT .721NH
C2T3 DIEOUT 0 .087PF
* Bond wire inductance
LLB 12 DIEIN .6NH
LLE 15 DIEGND .3NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .01PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 70 package7
*replace "MSA**70 in line 2 with product name
*e.g. : .SUBCKT MSA0870 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA08 DIEOUT DIEIN DIEGND MSA08
* "70" PACKAGE MODEL
.SUBCKT MSA**70 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .070PF
LT1 11 12 .224NH
C2T1 12 0 .070PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .019PF
LT2 14 15 .034NH
C2T2 15 0 .019PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .098PF
LT3 13 DIEOUT .312NH
C2T3 DIEOUT 0 .098PF
* Bond wire inductance
LLB 12 DIEIN .5NH
LLE 15 DIEGND .14NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .01PF
CCBC 12 DIEOUT .02PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 85 package
*replace "MSA**85" in line 2 with product name
*e.g. : .SUBCKT MSA0885 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE DIEOUT DIEIN DIEGND MSA08
* "85" PACKAGE MODEL
.SUBCKT MSA**85 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .059PF
LT1 11 12 .493NH
C2T1 12 0 .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .042PF
LT2 14 15 .076NH
C2T2 15 0 .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .039PF
LT3 13 DIEOUT .330NH
C2T3 DIEOUT 0 .039PF
* Bond wire inductance
LLB 12 DIEIN .55NH
LLE 15 DIEGND .1NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .03PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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- SPICE model for MSA Gain Blocks in style 86 package
*replace "MSA**86" in line 2 with product name
*e.g. : .SUBCKT MSA0886 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XA08DIE DIEOUT DIEIN DIEGND MSA08
* "86" PACKAGE MODEL
.SUBCKT MSA**86 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .059PF
LT1 11 12 .493NH
C2T1 12 0 .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .042PF
LT2 14 15 .076NH
C2T2 15 0 .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .039PF
LT3 13 DIEOUT .330NH
C2T3 DIEOUT 0 .039PF
* Bond wire inductance
LLB 12 DIEIN .55NH
LLE 15 DIEGND .1NH
* Contact inductance
LL1 IN 11 .55NH
LL2 GND 14 .06NH
LL3 OUT 13 .25NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .03PF
* INSERT DIE MODEL
XA**DIE DIEOUT DIEIN DIEGND MSA**
.ENDS
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