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SPICE Library: AT and HBFP Series Models

Models are available for the following devices:

AT-305
AT-310
AT-320
AT-414
AT-415
AT-420
AT-640
HBFP-0405
HBFP-0420
HBFP-0450

AT-305 Model

[ top ]

SPICE model

** DIE MODEL (excludes bond wires)
.SUBCKT AT305   75      20      85
CBBP    20      75      .03PF
CEBP    85      75      .03PF
QINT    75      20      85      Q305     
.ENDS

.MODEL  Q305    NPN (BF=100, BR=2.5, IS=7.8E-17, VA=20, TF=12PS, 
+               CJE=1.1E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=1.4E-2, IKF=6.3E-3, XTF=4, NF=1.03, ISE=2.4E-13,
+               NE=2.5, RB=38.49, RE=2.44, RC=61.57, CJC=5.1E-14, CJS=7E-14,
+               XCJC=0.19, PS=0.8, MS=0.5, PC=0.76, MC=0.53)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-30511 package 11 model

AT-30533 package 33 model

AT-310 Model

[ top ]

SPICE model

* DIE MODEL (excludes bond wires)
.SUBCKT AT310   75      20      85
CBBP    20      75      .03PF
CEBP    85      75      .03PF
QINT    75      20      85      Q310     
.ENDS

.MODEL  Q310    NPN (BF=100, BR=2.5, IS=1.6E-16, VA=20, TF=12PS, 
+               CJE=2.3E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=2.9E-2, IKF=1.3E-2, XTF=4, NF=1.03, ISE=4.8E-13,
+               NE=2.5, RB=19.44, RE=1.22, RC=40.68, CJC=9.5E-14, CJS=1E-13,
+               XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-31011 package 11 model

AT-31033 package 33 model

AT-320 model

[ top ]

SPICE model

* DIE MODEL (excludes bond wires)
.SUBCKT AT320   75      20      85
CBBP    20      75      .03PF; BASE BOND PAD CAPACITANCE
CEBP    85      75      .03PF; EMITTER BOND PAD CAPACITANCE
QINT    75      20      85      Q320     
.ENDS

.MODEL  Q320    NPN (BF=100, BR=2.5, IS=3.1E-16, VA=20, TF=12PS, 
+               CJE=4.6E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=5.7E-2, IKF=2.5E-2, XTF=4, NF=1.03, ISE=9.5E-13,
+               NE=2.5, RB=9.78, RE=0.61, RC=35.97, CJC=1.8E-13, CJS=1.7E-13,
+               XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-32011 package 11 model

AT-32033 package 33 model

AT-32086 package 63 model

AT-414 Model

[ top ]

SPICE model

* DIE MODEL (excludes bond wires)
.SUBCKT AT414   75      20      85
CCB     20      60      .032PF
DCD1    20      60      DMOD    572
RRB1    20      25      1.07    TC=0.8E-3
DCD2    25      60      DMOD    680
RRB2    25      30      3.2     TC=1.2E-3
DCD3    30      60      DMOD    340
RRB3    30      35      2.7     TC=1.8E-3
RRC     60      75      5       TC=0.6E-3
RRE     80      85      .24     TC=0.6E-3
CCE     60      85      .032PF
QINT    60      35      80      QDIS     420
.ENDS

.MODEL  DMOD    D(IS=1E-25, CJO=2.45E-16, VJ=.76, M=.53, BV=45, IBV=1E-9)
.MODEL  QDIS    NPN (BF=100, BR=2.5, IS=1.65E-18, VA=20, TF=12PS,
+               CJE=2.4E-15, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=3E-4, IKF=1.3E-4, XTF=4, NF=1.03, ISE=5E-15,
+               NE=2.5)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-41400 package 00 model

AT-41410 pkg dwg package 10 model

AT-41411 package 11 model

AT-41435 pkg dwg package 35 model

AT-41470 pkg dwg package 70 model

AT-41485 pkg dwg package 85 model

AT-41486 package 86 model

AT-415 Model

[ top ]

SPICE model

* DIE MODEL (excludes bond wires)
.SUBCKT AT415   75      20      85
CBBP    20      75      .064PF;  BASE BOND PAD CAPACITANCE
CEBP    85      75      .064PF;  EMITTER BOND PAD CAPACITANCE
QINT    75      20      85      Q415    
.ENDS

.MODEL  Q415    NPN (BF=100, BR=2.5, IS=4.2E-16, VA=20, TF=12PS,
+               CJE=6E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=7.6E-2, IKF=3.4E-2, XTF=4, NF=1.03, ISE=1.3E-12,
+               NE=2.5, RB=11.57, RE=0.4, RC=18.03, CJC=2.5E-13, CJS=2.3E-13,
+               XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-41511 package 11 model

AT-41533 package 33 model

AT-41586 package 86 model

AT-420 Model

[ top ]

SPICE model

** DIE MODEL (excludes bond wires)
.SUBCKT AT420   75      20      85
CCB     20      60      .034PF
DCD1    20      60      DMOD    783
RRB1    20      25      0.7     TC=0.8E-3
DCD2    25      60      DMOD    972
RRB2    25      30      2.2     TC=1.2E-3
DCD3    30      60      DMOD    486
RRB3    30      35      1.9     TC=1.8E-3
RRC     60      75      5       TC=0.6E-3
RRE     80      85      .17     TC=0.6E-3
CCE     60      85      .034PF
QINT    60      35      80      QDIS     600
.ENDS

.MODEL  DMOD    D(IS=1E-25, CJO=2.45E-16, VJ=.76, M=.53, BV=45, IBV=1E-9)
.MODEL  QDIS    NPN (BF=90, BR=2.5, IS=1.7E-18, VA=20, TF=12PS,
+               CJE=2.4E-15, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=3E-4, IKF=1.3E-4, XTF=4, NF=1.03, ISE=5E-15,
+               NE=2.5)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-42000 package 00 model

AT-42010 pkg dwg package 10 model

AT-42035 pkg dwg package 35 model

AT-42070 pkg dwg package 70 model

AT-42085 pkg dwg package 85 model

AT-42086 package 86 model

AT-640 Model

[ top ]

SPICE model

** DIE MODEL (excludes bond wires)
.SUBCKT AT640   75      20      85
QINT    75      20      85      Q640     
.ENDS

.MODEL  Q640    NPN (BF=100, BR=2.5, IS=2E-15, VA=20, TF=12PS, 
+               CJE=2.9E-12, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+               VTF=6, ITF=3.6E-1, IKF=1.6E-1, XTF=4, NF=1.03, ISE=6E-12,
+               NE=2.5, RB=2.83, RE=0.8, RC=33.95, CJC=1.6E-12, CJS=1.1E-12,
+               XCJC=0.15, PS=0.8, MS=0.5, PC=0.76, MC=0.53)

To complete the transistor model, the above die model must be combined with one of the following package models.

AT-64020 pkg dwg package 20 model

AT-64023 pkg dwg package 23 model

HBFP-0405 Model

[ top ]

SPICE model

* PSPICE MODEL for HBFP-0405 in SOT343

.SUBCKT HBFP0405   60      20      40
LL1     20      25      .22NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    25      0       .08PF
LT1     25      30      .20NH
C2T1    30      0       .05PF
*
LLB     30      35      .70NH
CCEB    30      50      .04PF
LL2     40      45      .15NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    45      0       .04PF
LT2     45      50      .10NH
C2T2    50      0       .10PF
*
LLE     50      55      .20NH
CCEC    50      70      .01PF
LL3     60      65      .20NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    65      0       .144PF
LT3     65      70      .50NH
C2T3    70      0       .10PF
*
LLC	70	75	.70PF	
CCBC    30      70      .05PF
* CALL DIE MODEL
XDIE    75      35      55      H0405
.ENDS

.SUBCKT H0405   75      20      85
RBX 	20	130	3.74196
RCX	140 	75    	6.5915
RE	150 	85	1.565       
RSE	160	85	1
CCOX 	20     	140    	17.213E-15
CEOX 	130    	85     	6.227E-15
DBC	20	140	DMOD1
DBE	130	150	DMOD2
DCS	160	140	DMOD3
QINT  	140    	130	150	160	Q405     
.ENDS

.MODEL  DMOD1   D(IS=1.40507E-17,CJO=2.393E-14,VJ=.729,M=.44,TNOM=21,N=1,FC=0.8)
.MODEL  DMOD2   D(IS=1E-24,CJO=2.593E-14,VJ=.8971,M=.2292,TNOM=21,N=1.0029,FC=0.8)
.MODEL  DMOD3   D(IS=1E-24,CJO=8.974E-14,VJ=0.6,M=0.42 ,RS=2.17347E2,FC=0.8TNOM=21)

.MODEL  Q405    NPN (BF=1E6, IS=4.4746E-18,  VA=44,
     +    BR=1,     ME=0.5063,     NF=1,    PTF=22,
     +    TF=5.3706E-12,    CJE= 7.474248E-14,   XTF=20,     IK=1.4737E-01,
     +    PE=0.9907,    ISE=7.094E-20,     NE=1.006,    VTF=0.8,
     +    XTB=0.7,    ITF=2.21805486E-1,  RB=9.30144818,
     +    CJC=2.7056E-14,  XCJC=0.439790997,
     +    PC=0.6775,     MC=0.3319,  FC=0.8,  IKR=1.1E-2, NC=2, VAR=3.37,
     +    NR=1.005, TR=4E-9, TNOM=21, IRB=3.029562E-6, RBM=0.1, XTI=3
     +    EG=1.17)

* Note: high beta value compensates for current leakage through DBE

HBFP-0420 Model

[ top ]

SPICE model

* PSPICE MODEL for HBFP-0420 in SOT343

.SUBCKT HBFP0420   60      20      40
LL1     20      25      .22NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    25      0       .08PF
LT1     25      30      .20NH
C2T1    30      0       .05PF
*
LLB     30      35      .70NH
CCEB    30      50      .04PF
LL2     40      45      .15NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    45      0       .04PF
LT2     45      50      .10NH
C2T2    50      0       .10PF
*
LLE     50      55      .20NH
CCEC    50      70      .01PF
LL3     60      65      .20NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    65      0       .144PF
LT3     65      70      .50NH
C2T3    70      0       .10PF
*
LLC	70	75	.70PF	
CCBC    30      70      .05PF
* CALL DIE MODEL
XDIE    75      35      55      H0420
.ENDS

.SUBCKT H0420   75      20      85	
RBX 	20	130	3.74196
RCX	140 	75    	6.5915
RE	150 	85	1.565       
RSE	160	85	1
CCOX 	20     	140    	17.213E-15
CEOX 	130    	85     	6.227E-15
DBC	20	140	DMOD1 3
DBE	130	150	DMOD2 3
DCS	160	140	DMOD3 3
QINT  	140    	130	150	160	Q405 3   
.ENDS

.MODEL  DMOD1   D(IS=1.40507E-17, CJO=2.393E-14,
+               VJ=.729, M=.44, TNOM=21, N=1, FC=0.8)
.MODEL  DMOD2   D(IS=1E-24, CJO=2.593E-14, VJ=.8971,
+               M=.2292, TNOM=21, N=1.0029, FC=0.8)
.MODEL  DMOD3   D(IS=1E-24, CJO=8.974E-14, VJ=0.6,
+               M=0.42, RS=2.17347E2, FC=0.8, TNOM=21)

.MODEL  Q405    NPN (BF=1E6, IS=4.4746E-18, VA=44,
     +    BR=1,ME=0.5063, NF=1, PTF=22, TF=5.3706E-12,
     +    CJE= 7.474248E-14, XTF=20, IK=1.4737E-01,
     +    PE=0.9907, ISE=7.094E-20, NE=1.006, VTF=0.8,
     +    XTB=0.7, ITF=2.21805486E-1, RB=9.30144818,
     +    CJC=2.7056E-14, XCJC=0.439790997,
     +    PC=0.6775, MC=0.3319, FC=0.8, IKR=1.1E-2, NC=2, VAR=3.37,
     +    NR=1.005, TR=4E-9, TNOM=21, IRB=3.029562E-6, RBM=0.1, XTI=3
     +    EG=1.17)
	 
* Note: high beta value compensates for current leakage through DBE

HBFP-0450 Model

[ top ]

SPICE model

.SUBCKT HBFP0450   60      20      40
LL1     20      25      .22NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1    25      0       .08PF
LT1     25      30      .20NH
C2T1    30      0       .05PF
*
LLB     30      35      .70NH
CCEB    30      50      .04PF
LL2     40      45      .15NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2    45      0       .04PF
LT2     45      50      .10NH
C2T2    50      0       .10PF
*
LLE     50      55      .20NH
CCEC    50      70      .01PF
LL3     60      65      .20NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3    65      0       .144PF
LT3     65      70      .50NH
C2T3    70      0       .10PF
*
LLC	70	75	.70PF	
CCBC    30      70      .05PF
* CALL DIE MODEL
XDIE    75      35      55      HP0450
.ENDS

.SUBCKT HP0450   75      20      85
RBX 	20	130	0.20995
RCX	140 	75    	0.4
RE	150 	84	0.1565       
RSE	160	85	1
RBAL	84	85	1.4
CCOX 	20     	140    	0.24 E-12
CEOX 	130    	84     	6.227E-14
DBC	20	140	DMOD1
DBE	130	150	DMOD2
DCS	160	140	DMOD3
QINT  	140    	130	150	160	Q450     
.ENDS

.MODEL  DMOD1   D(IS=1.40507E-17, CJO=2.393E-14,
+               VJ=.729, M=.44, TNOM=21, N=1, FC=0.8)
.MODEL  DMOD2   D(IS=1E-24, CJO=2.593E-14, VJ=.8971,
+               M=.2292, TNOM=21, N=1.0029, FC=0.8)
.MODEL  DMOD3   D(IS=1E-24, CJO=4.6443E-13, VJ=0.6,
+               M=0.42, RS=1.5804E2, FC=0.8, TNOM=21)

.MODEL  Q450    NPN (BF=1E6, IS=3.01E-17, VA=44, BR=1, 
     +    ME=0.5063, NF=1, PTF=22, TF=5.3706E-12, 
     +    CJE= 9.48E-14, XTF=20, IK=1.4737E-01, PE=0.9907, 
     +    ISE=5E-19, NE=1.006, VTF=0.8, XTB=0.7, 
     +    ITF=2.21805486, RB=9.30144818E-1, CJC=1.87E-14, 
     +    XCJC=0.439790997, PC=0.6775, MC=0.3319, FC=0.8, 
     +    IKR=1.1E-1, NC=2, VAR=30.37, NR=1.005, TR=4E-9, 
     +    TNOM=21, IRB=3.029562E-5, RBM=0.01, XTI=3, EG=1.17)

* Note: high beta value compensates for current leakage through DBE

this page last updated: 1 October 1999